Wafer Biscuit Cutting Machine
1. Function:
1). The cutting machine is used for cutting the cream-spread and laminated wafer into required size.
2). The machine is equipped with to-and-fro conveying belt and it can cut the wafer block to all sizes.
3). It is the wire or blade cut machine to cut the cream filled wafer sheets depending on the final size required.
4). The cutting size can be continently adjustable.
5). This machine is preumatcially handled so that the smooth transfer through the machine is ensured.
6). The direction changing to have longitudinal and cross will be done automatically.
2. Technical Parameter:
·Cutting Method: Blade or Steel Wire type
·Cutting Capacity: 25pieces/min
·Dimension: 2400×2100×1000mm
·Power: 0.55kW
3. Trade Condition
1. Function:
1). The cutting machine is used for cutting the cream-spread and laminated wafer into required size.
2). The machine is equipped with to-and-fro conveying belt and it can cut the wafer block to all sizes.
3). It is the wire or blade cut machine to cut the cream filled wafer sheets depending on the final size required.
4). The cutting size can be continently adjustable.
5). This machine is preumatcially handled so that the smooth transfer through the machine is ensured.
6). The direction changing to have longitudinal and cross will be done automatically.
2. Technical Parameter:
·Cutting Method: Blade or Steel Wire type
·Cutting Capacity: 25pieces/min
·Dimension: 2400×2100×1000mm
·Power: 0.55kW
3. Trade Condition
| Payment Terms | T/T or L/C |
| Loading Port | FOB Zhaoqing Port |
| Delivery Time | 30 days |
| Production Capacity | 5 sets / month |