USAGE
Drilling blind holes, vias in HDI board, blind cut and blind slot in rigid-flex board. Cutting a variety of FPC and cover layer, low carbonization. Cutting FPC and copper substrate thickness up to 1 mm, smooth appearance. Precisely etching of functional film. Cutting the base material.
CHARACTERISTIC
1. Safe and reliable. Fully enclosed design, automatic control of worktable door to ensure safe operation;
2. Automation. Auto focus, auto-correction, auto-positioning, auto-homing, automatic spot compensation, and intelligent design;
3. Energy measuring. Automatically measure energy on the samples;
4. High drilling / cutting precision. Using ultra-high-precision scanning galvanometer, fully guaranteed drilling, cutting accuracy and quality;
5. Multi-panels cutting. With function to cutting array panels;
6. Optical optimization. High peak power and high pulse energy, fine focal spot, ensure cutting and drilling with high speed and high precision;
7. Convenient operation. Drilling and cutting with independent module, easy conversion;
8. Optimize design. Optimization of laser processing path function, reduce processing time and improve efficiency.
Drilling blind holes, vias in HDI board, blind cut and blind slot in rigid-flex board. Cutting a variety of FPC and cover layer, low carbonization. Cutting FPC and copper substrate thickness up to 1 mm, smooth appearance. Precisely etching of functional film. Cutting the base material.
CHARACTERISTIC
1. Safe and reliable. Fully enclosed design, automatic control of worktable door to ensure safe operation;
2. Automation. Auto focus, auto-correction, auto-positioning, auto-homing, automatic spot compensation, and intelligent design;
3. Energy measuring. Automatically measure energy on the samples;
4. High drilling / cutting precision. Using ultra-high-precision scanning galvanometer, fully guaranteed drilling, cutting accuracy and quality;
5. Multi-panels cutting. With function to cutting array panels;
6. Optical optimization. High peak power and high pulse energy, fine focal spot, ensure cutting and drilling with high speed and high precision;
7. Convenient operation. Drilling and cutting with independent module, easy conversion;
8. Optimize design. Optimization of laser processing path function, reduce processing time and improve efficiency.
| Item | Specification |
| MODEL | JG21 |
| Laser Source | All-solid-state UV laser cutting device,wavelength 355nm |
| Laser Power | 10W |
| Laser Frequency | 5-250KHz |
| Maximum Processing Size | 650mm×560 mm(25.6″×22″) |
| Platform Maximum Operating Speed | 60m/min |
| Platform Maximum Positioning accuracy | ±3µm |
| Platform Maximum Repeat Positioning accuracy | ±1µm |
| System Processing Precision | ±20µm |
| Minimum Blind hole Aperture | 50µm |
| File format | Gerber,DXF |
| Power | AC 220V/50HZ/2.5KW;AC 380V50HZ/5.5KW |
| Cleaning Requirements | 516m3/h |
| Overall Dimensions | 1610mm×1660 mm×1550 mm |
| Weight | 2900kg |
| Environmental Temperature | 20ºC±2ºC |
| Environmental Humidity | <60%RH no dew |
| Ground Amplitude | <5µm |
| Vibration Acceleration | <0.05G |
| Ground Pressure | 12000kgf/m2 |
| Industry-specific control machine, computer installed drilling and cutting software |
Motion control card and industry machine control mode Equipped with 17 screens, 300G hard disk |